Samsung Galaxy S9 and S9 Plus to reportedly come with variable aperture, SLP motherboard and more

The **Samsung Galaxy S9** and S9 Plus are expected to be unveiled at the MWC 2018 event next month and the rumours mill has started speculating. According to a new report, the S9 and S9 Plus are likely to feature a f/1.5 aperture camera lens, Substrate Like PCB (SLP) technology, and a Y-Octa display. [caption id=“attachment_4300923” align=“alignleft” width=“380”] An anonymous Weibo user released an image of what is claimed to be the Galaxy S9 and S9 Plus[/caption] According to a  report by Korean news website ETNews, that the Galaxy S9 will feature a variable aperture f/1.5 to f/2.4 enabling the aperture to be adjusted like a DSLR camera. This alongside an expected dual-camera setup on the back side and front facing iris scanner should make the Galaxy S9 and S9 Plus, very formidable devices in the smartphone market. The report also claims that the Samsung will also introduce an SLP motherboard technology for the first time on a Samsung device. For the uninitiated, this technology will reportedly make more space for adding in components like bigger battery, faster chipsets and more. The iPhone X also uses the Stacked SLP technology to fit two battery parts. Samsung is also reportedly introducing the Y-Octa (Youm On-Cell Touch AMOLED) OLED technology on its display which will make the touch interface smoother and also reduce production costs by around 30 percent. However, one thing we do know for sure is that the S9 and S9 Plus will definitely have Samsung’s curved Infinity Display along with the latest Qualcomm **Snapdragon  845 SoC** . The device may pack an under-the-display fingerprint sensor. However, the chances of that seem quite bleak as many renders have shown a fingerprint sensor placed at the back of the phone.