Ultra-slim Phone Cams Get 3MP Image Sensor

Samsung has announced the world’s first 3 megapixel (MP) CMOS image sensor (CIS) with a 1/4-inch lens aperture that is well suited for ultra slim camera phones.

“The rapidly evolving trend of user created content, blogs, and personal web pages is triggering demand for constant access to high-resolution images, bringing the consumer’s attention to high-resolution camera phones,” said Yong-Hee Lee, vice president of Samsung Electronics’ System LSI Division. “Our 1.75um-pixel, 1/4-inch lens aperture 3MP CIS is a unique combination of Samsung’s high resolution sensor technology and high speed serial interface that brings digital still camera-level picture quality to mobile handsets.”

Samsung’s new 1.75um-size pixel enables the 1/4-inch lens aperture to drastically reduce the camera module size by 30 percent as opposed to a conventional 2.25um pixel 1/3-inch lens aperture 3MP CIS. The small form factor allows the 1.75um-pixel, 1/4-inch lens aperture 3MP CIS to immediately replace a 1/4-inch lens aperture 2MP CIS module, as it shares the same physical measurements with the new 3MP CIS.

The 1.75um pixel, 1/4-inch lens aperture 3MP CIS shows no degrading in the picture quality compared to a 2.25um pixel, 1/3-inch lens aperture 3MP CIS. The new CIS chip provides a small form factor and high picture quality.

By utilizing 90-nanometer (nm) process technology, Samsung expects to mass produce the new 1.75um pixel, 1/4-inch lens aperture 3-MP CIS in the first quarter of 2007.