Samsung has announced that it is on track to widen its foundry process portfolio by offering 11 nanometer (nm) and 7 nm chips from 2018. Samsung has scaled its earlier 14 nm Low Power Plus (LPP) process to a 11 nm LPP process, delivering a 10 percent reduction in chip area, along with a 15 percent boost to performance. The development of the 7 nm LPP process with extreme ultra violet lithography technology is also on track.
Since 2014, Samsung has produced over 200,000 wafers using the extreme ultra violet lithography technology. The first 11 nm chips are expected to be produced from the first half of 2018, while the first 7 nm chips will be produced from the second half of 2018. The 11 nm and 7 nm processes will complement the 10 nm FinFET process, providing a range of differentiated options for mid range to high end smartphones.
Ryan Lee, Vice President and Head of Foundry Marketing at Samsung Electronics, says "Samsung has added the 11nm process to our roadmap to offer advanced options for various applications. Through this, Samsung has completed a comprehensive process roadmap spanning from 14nm to 11nm, 10nm, 8nm, and 7nm in the next three years."
More details on the roadmap of Samsung's foundry, including the availability of the 11 nm chips and the development of the 7 nm process will be revealed on 15 September, at the Samsung Foundry Forum in Tokyo, Japan. The Samsung Galaxy S9, an anticipated competitor to the iPhone 8, is expected to have the latest 7 nm and 8 nm chips from Samsung.