Samsung to mass produce 6Gb LPDDR3 chips using 20nm fabrication process

Samsung has begun the mass production of the 6Gb LPDDR3 memory chips using the 20 nanometer manufacturing process technology. These chips will be used in the creation of 3GB LPDDR3 memory modules which will be seen in smartphones and tablets. The main reasoning behind having a 20nm process is making the memory modules more energy efficient and relatively cheaper to make.   The Samsung 6Gb LPDDR3 package will feature a 2133Mbps per pin data transfer rate. Four of these 6Gb modules will make up the 3GB LPDDR3 package, and at the moment, Samsung is sticking to 3GB capacity. In the future you can get  higher-density memory solutions for 64-bit mobile devices. Thanks to the 20nm process, the new 3GB LPDDR3 package will be 20 percent smaller and about 10 percent more energy efficient than the current 3GB LPDDR3 modules. Also manufacturing the new 6Gb LPDDR3 chips is 30 percent cheaper to produce than the last-generation 6Gb chips.   “Our new 20nm 6Gb LPDDR3 DRAM provides the most advanced mobile memory solution for the rapidly expanding high-performance mobile DRAM market,” said Jeeho Baek, vice president of memory marketing at Samsung Electronics. “We are working closely with our global customers to offer next-generation mobile memory solutions that can be applied to a more extensive range of markets ranging from the premium to standard segments.”