Qualcomm's upcoming 7 nm-based Snapdragon 855 Fusion Platform will include the X50 5G modem

**Qualcomm Snapdragon 845** devices have just started hitting the market with the majority of device makers still working on an 845-powered flagship. [caption id=“attachment_4382321” align=“alignleft” width=“380”] Qualcomm 855 Fusion Platform. Image: SoftBank[/caption] In the midst of it all, **Qualcomm** has already started working on the next generation of SoC, the Snapdragon 855. The company has not revealed any details regarding the 855 at the time of writing. According to a recent report by GizmoChina, Softbank has revealed in one of its presentations that ‘Snapdragon 855 SDM855 Fusion Platform’ will come with SDX50 5G Modem. The presentation also pointed out that telecom equipment vendors such as Samsung, Nokia and Ericsson will start deploying ‘Massive MIMO sites from 2018’ where MIMO refers to multiple-input and multiple output, while expanding these sites to ‘all major markets in 2019.’ This comes weeks **after it was reported** that Snapdragon 855 will be based on a 7 nm manufacturing process instead of the 10 nm manufacturing process that is used to make the Snapdragon 845 and 835. It **was also reported that** Taiwan Semiconductor Manufacturing Co (TSMC) will be responsible for manufacturing the 855 instead of Samsung in case of 835 and 845.