Qualcomm Snapdragon 670 chipset specifications reportedly leaked; could be unveiled at MWC 2018

For quite some time now, there have been rumours of an upper mid-range Qualcomm Snapdragon SoC called the Snapdragon 670 which is tipped to succeed the Snapdragon 660 launched last year. Now, well-known tipster, Roland Quandt has shed some light on the specs of this new chipset from Qualcomm which is expected to be announced at **MWC 2018** this month. [caption id=“attachment_4150587” align=“alignleft” width=“380”] Representational image. Qualcomm[/caption] According to the report by Winfuture, just like the **Snapdragon 845** , the 670 is also reportedly being manufactured using a 10 nm process. Inside the chipset, there will be the big.LITTLE architecture wherein a combination of low-end hexa-core processor and a high-end dual-core processor will be present. The low-end processors, called the Kryo 300 Silver, will be clocked at 2.6 GHz and the high-end processor, called the Kryo 300 Gold, will be clocked at 1.7 GHz. The cores hold a total of 32 KB L1 cache and for the entire SoC we see a 1 MB of L3 cache. In terms of the GPU, the Snapdragon 670 will have an Adreno 615 which can max out at 700 MHz and also support dual-camera configuration of up to a 13 MP + 23 MP setup. The chipset has a support for WQHD display and will also provide download speeds of up to 1 Gbps. Even though it is expected that Qualcomm will announce the chipset at MWC this year, there is no confirmation to support this fact. Also, it isn’t immediately clear which smartphone brand will get to call first dibs on the new SoC.