 "Kindle Fire holds components from TI, Samsung, Hynix and LG")
News about Amazon shipping their Kindle Fire, earlier than expected along with the recently announced Nook has further stirred the tablet war. Amazon Fire, supposedly a low cost competitor to the iPad is predicted to be the hottest selling device during the fast approaching holiday season. So, iFixit decided to crack open the Kindle Fire to find out what it held within.
Kindle Fire cracked open (Image Credit: iFixit)
With so much being written about this Kindle device, it was obvious that companies were looking closely at the device and it components. Amazon has also declared that it will increase the production to meet consumer demands during Christmas. Miroslav Djuric, Director of Technical Communication at iFixit said, “iFixit opened the Kindle Fire on Tuesday and an early look inside showed that the device includes chips made by Texas Instruments, Samsung and Hynix.”
Reportedly, the Kindle Fire runs on a list of components like Texas Instruments OMAP 4430 processor, Samsung 8GB flash memory chip, Hynix DDR2 RAM and a display from LG. “The case opens up similarly to the PlayBook but inside it has a completely different layout, smaller battery, and different orientations for its components." Djuric revealed further.
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