IBM Ships Microchips for the Wii

IBM has announced that its microprocessors code-named ‘Broadway’, for Nintendo’s upcoming Wii video game console are being shipped from IBM’s Fishkill, N.Y., fabrication facility.

“The first chips are in our possession,” said Genyo Takeda, Senior Managing Director/General Manager, Integrated Research & Development Division, Nintendo Co., Ltd. “Today’s milestone marks the final stage of our drive to reach both core and nontraditional gamers with an inviting, inclusive and remarkable gaming experience.”

Under the terms of the agreement, IBM will produce millions of fully tested, Power Architecture-based chips featuring IBM Silicon on Insulator (SOI) technology at 90 nanometers (90 billionths of a meter), based on the specifications of the custom design agreement previously agreed upon by the two companies.

Microchips based on the Power Architecture are the electronic brain of devices large and small, and are inside automotive safety systems, printers, routers, servers and the world’s most powerful supercomputers.

“The IBM team has worked hard to design, develop and deliver this customized Power microprocessor for the worldwide launch of Nintendo’s new system,” said Ron Martino, director, IBM Technology Collaboration Solutions. “When millions of gamers take the controls of Wii this holiday season, the IBM logo will once again be front and center on this innovative new product.”