Huawei to show off new octa-core SoC this year

Despite all of the big chip companies having announced, and even launched, their new mobile chips, Huawei has been quiet about its next-gen chip. According to GSMInsider , the company is going to be showing off the Hisilicon K3V3 chip soon. The chip is set to be quite powerful with an octa-core setup and will be clocked up to 1.8GHz. The GPU on the chip will be Mali based on the 28nm process. The K3V3 chip will be making its debut towards the end of the year.

Despite the power in the chip, however, it won’t face many heating and battery issues. Huawei has invented a new cooling system that lets the processor automatically recharge when it’s at high temperature. This, while charging the phone itself, will also help in keeping it cooler.

Huawei’s new chip will be quite a beast, especially with that cooling system (image credit: GSMInsider)

The most recent handset unveiled by Huawei— the Ascend P6 —runs on the K3V2E chip, which is essentially a refresh of the older K3V2 chip. The Ascend P6 features a 4.7-inch HD in-cell display with a resolution of 1280 x 720 pixels. The phone seems to have a really thin bezel as well as on-screen buttons.

The audio needs have not been forgotten, as the smartphone features Dolby Digital Plus sound. The Ascend P6 is powered by a 2000mAh battery and supports GSM/UMTS/HSPA+. The overall weight of the smartphone stands at 120 g.

Adding to that, the smartphone comes in with a 1.5GHz quad-core K3V2E processor as well as 2GB of RAM. The internal memory that the phone features stands at 8GB, which is expandable via the microSD card slot.

The Ascend P6 also features an 8 megapixel camera with an f/2.0 BSI lens on the rear and an 5 megapixel front camera. The Ascend P6 runs on Android 4.2 Jelly Bean that is supplemented with Huawei’s customary Emotion User Interface.