CoolerMaster launches new vapour chamber based TPC 812 air cooler

CoolerMaster launched their latest air cooler, the TPC 182 that uses vapour chamber technology commonly found in the heatsinks of graphics cards. They say that it can achieve cooling levels of an all-in-one liquid cooler, but with the hassle of installing the radiator and so on. The TPC 812 marks a paradigm shift in the way air coolers are designed. Fundamentally, it combines many of CoolerMaster’s best technologies to produce one cooler that gives you the best of both worlds. The TPC 812 is the first CPU cooler to utilize Vertical Vapour Chamber technology for transfer of heat from the CPU block to the fins. Working in tandem, the six additional heat pipes aid the vapour chamber in the cooling process and the unit as a whole can handle more than 250W of heat.

With vapor chamber

The base of the cooler is 100 percent pure polished copper with improved solder reflux technique, which increases thermal transfer between the cooler base and the CPU heat spreader. The fin structure has been refined, too. The fin layout is optimized for maximum air pressure and the fan characteristics are tweaked for more airflow, yet silent operation. The fan mounting system has been improved for quick and effortless mounting. The cooler uses two separate cooling technologies to transfer heat - heat pipes and vertical vapour chambers. This is the first ever CPU cooler to use a vertical vapour chamber which helps the heat from the CPU hotpots to spread and transfer better. CoolerMaster also supports all socket types out-of-the-box including Socket 2011 from Intel.

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The specifications of the cooler are as follows:

• Intel Socket: LGA 2011 / 1366 / 1156 / 1155 / 775 

• AMD Socket: FM1 / AM3+ / AM3 / AM2+ / AM2

• Fan Noise Level (dB-A)  - 19 - 40 dBA

• Dimension  - 138 x 103 x 163mm (5.4 x 4.1 x 6.4 in)

• Weight    826g (1.83 lb)

• Bearing Type - Long Life Sleeve Bearing