Yet another leak appears to confirm that the upcoming Xiaomi Mi 6X will indeed feature an iPhone X-like vertical camera bump on the rear.
The days leading up to Mobile World Congress are expectedly full of leaks and reveal a great deal about upcoming phones. One company that all of us are keeping a close eye on is Xiaomi, and the company’s latest flagship has everyone interested.
The flagship, expected to be dubbed the Mi 6X, is supposed to come with a 5.7-inch display in a tall 18:9 aspect ratio. It’s also expected to be powered by Xiaomi’s in-house Surge S2 chipset, which uses various ARM Cortex cores and is built using a 16 nm process.
Leaked images of the rear of the device already indicated that the phone would use vertically stacked dual-cameras, and this leak, by GizChina and TechnoCodex has been reinforced by two other leaks from case makers, who are making cases with vertical camera cut-outs.
It’s notable that the camera bump and placement is nearly identical to that on the iPhone X. For Xiaomi, copying an existing Apple design shouldn’t make them squeamish because the company already has a history of aping Apple’s best.
Updated Date: Feb 02, 2018 17:43 PM