Huawei's Kirin 970 records LTE downlink speeds of up to 1.2 Gbps

Huawei’s HiSilicon **Kirin 970** could have become the first chipset to record data downlink speeds of up to 1.2 Gbps after including support for Cat 18 LTE for the first time. The speed was measured in a test conducted by equipment manufacturing company, Rohde & Schwarz. [caption id=“attachment_3952135” align=“alignleft” width=“380”] Kirin 970 chipset. Image: Weibo[/caption] According to a  report by GizmoChina, the results of the test and the speed recorded puts Huawei’s new chipset ahead of  **Qualcomm** Snapdragon 835 chipset which had earlier recorded downlink speeds of up to 1 Gbps. Snapdragon 835 packs support for Category 16 downlink LTE which caps at 1 Gbps downlink speed. “The Kirin 970 has become the first SoC to support LTE Cat 18 downlink and Cat 13 uplink connectivity with a peak downlink speed at 1.2 Gbps. A new milestone has been achieved to show that Huawei’s Kirin SoC is once again in a leading position in the LTE-A-pro wireless communication industry,” said Ai Wei, a Huawei fellow in a company blog post. According to a report by Android Headlines, Kirin 970 is also capable of Category 13 uplink LTE which allows upload speeds of up to 150 Mbps which is on par with Snapdragon 835. Huawei **announced**  Kirin 970 at IFA 2017 in Berlin, which concluded earlier this month. The 970 comprises of four ARM Cortex A73 CPUs clocked at 2.4 GHz and another four ARM Cortex A53 CPUs at 1.8 GHz. 970 also packs a 12-core GPU and it is made using the 10 nm process node technology to improve power efficiency.